An epoxy/silicone hybrid resin composition is provided comprising (A) an organosilicon compound having at least one silicon-bonded hydroxyl group, (B) a modified epoxy resin which is free of a phenylene ether skeleton and has reactive hydroxyl groups wherein some or all of the hydrogen atoms of the reactive hydroxyl groups are substituted by monovalent hydrocarbon groups or silyl groups, and (C) an aluminum base curing catalyst. The compatibility between silicone and epoxy resins is improved without a need for compatibilizing agent.