A hermetically sealed package for electronic circuit components includes a generally hollow, titanium body, having a reduced thickness bottom wall/floor, whose interior surface is laminated with a relatively low mass, insert, upon which electronic circuit components are mounted. The insert has a high thermal conductivity and a low coefficient of thermal expansion, approximate to that of the housing body.

 
Web www.patentalert.com

< Marking device and method for golf ball

> Tire sealing and inflation device

> Olefin copolymers containing hydrolytically cleavable linkages and use thereof in degradable products

~ 00545