A semiconductor device including a first field effect transistor having a source, a first conductivity type drain, a gate, and a first conductivity type channel layer formed beneath the gate and between the source and the drain. The device also includes a first conductivity type well region, a second conductivity type channel layer formed on the surface of the well region, a first wire that connects an end of the second conductivity type channel layer to the first conductivity type drain, a second wire that connects the other end of the second conductivity type channel layer to a power source, and a third wire 208 that connects the first conductivity type well region to the gate of the first field effect transistor. This semiconductor device and manufacturing method thereof enables low power consumption and simple control of threshold voltage values as well as decreases the number of conventional manufacturing processes.

 
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> Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package

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