A microelectronic resilient structure can comprise a support member and a
platform attached to the support member. The platform can comprise a
non-conductive, resilient beam that extends away from the support member,
and a plurality of conductive members can be disposed on the beams. The
conductive members can extend along a length of the beam. A plurality of
conductive contact elements can be disposed on the beam and electrically
connected to one of the conductive members.