Package substrates for optical die structures are generally described. In
one example, an apparatus includes a package substrate having one or more
plated through hole (PTH) structures, an optical waveguide coupled with
the package substrate, the optical waveguide having one or more
input/output (I/O) optical signal pathways to route I/O signals to and
from the package substrate, and one or more optical fibers coupled with
the optical waveguide, the one or more optical fibers being disposed in
the PTH structures to route I/O signals to and from a motherboard.