A potting shell, for an electronic circuit on a circuit board, comprises a wall arrangement, which defines a shell volume at least in one spatial direction and in the directions perpendicular thereto; wherein the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound. The volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound, characterized in that the main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of the flexible section.