A light emitting diode (LED) package including a carrier, an LED chip, a first transparent encapsulant, a transparent cap, and a second transparent encapsulant is provided. The carrier has a carrying surface and a ring frame disposed on the carrying surface, and the ring frame forms an encapsulant-containing space on the carrying surface. The LED chip is disposed on the carrying surface and in the encapsulant-containing space. The LED chip is electrically connected to the carrier. The first transparent encapsulant fills the encapsulant-containing space to encapsulate the LED chip. The transparent cap is disposed on the carrier to cover the first transparent encapsulant and the ring frame. The second transparent encapsulant fills an interval between the first transparent encapsulant and the transparent cap.