A fluid ejection device, including a substrate carrier having a substrate receiving-surface, and a substrate having at least one fluid ejector actuator disposed on the substrate. In addition the fluid ejection device includes a one-part adhesive disposed between the substrate and the substrate-receiving-surface. The one-part adhesive is an epoxy resin having a polyglycidyl ether of a polyhydric phenol, a solid cylcoaliphatic amine curing agent.