Apparatuses and methods for forming wireless RF labels are claimed. In one embodiment, a flexible layer may be made to receive an array of integrated circuit chips The integrated circuit chips may be powered by a signal from a transmitter which beams the information to the wireless RF labels. The method includes coupling a plurality of integrated circuit chips to a flexible web material and advancing the flexible web material through a web processing apparatus. A metallization material is patterned on the flexible web material. The flexible web material can be coupled to a second web material.