An electronic device. The device comprises a printed circuit board, a multilayered capacitor formed on the printed circuit board, and a conductive strip disposed on a top surface of the printed circuit board. The conductive strip interconnects to the multilayered capacitor. The multilayered capacitor includes a plurality of capacitance plates and a plurality of dielectric layers wherein each dielectric layer is disposed between two of the capacitance plates. The printed circuit board further comprises ground plated sidewalls disposed about the printed circuit board. Each of the ground plated sidewalls extends from a top surface to a bottom surface of the printed circuit board.