The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the air guide. The heat sink of the air guide increases the area of heat dissipation, and the distribution of the heat sink enables more blown-in air to carry the heat away. Accordingly, the air guide of the invention can increase the efficiency of heat dissipation within an electronic device.