Embodiments of the present disclosure include a method of fabricating
interferometric devices using lift-off processing techniques. Use of
lift-off processing in the fabrication of various layers of
interferometric modulators, such as an optical stack or a flex layer,
advantageously avoids individualized chemistries associated with the
plurality of materials associated with each layer thereof. Moreover, use
of lift-off processing allows much greater selection in both materials
and facilities available for fabrication of interferometric modulators.