A secure circuit assembly includes a printed circuit board including first and second surfaces and a secure boundary area in the first surface. A circuit to be protected is located in the secure boundary area. A first inner enclosure is attached to the first surface of the printed circuit board and covers the secure boundary area in the first surface. A first sensor film is attached to the first inner enclosure and is electrically coupled to the printed circuit board. The secure circuit assembly also includes first and second outer enclosures, the first outer enclosure covering the first inner enclosure and the second outer enclosure covering the second inner enclosure. A method for providing security to a circuit assembly is also disclosed.