This invention provides an electronic component mounting apparatus which can detects an electronic component held by a suction nozzle without fail after a mounting operation of electronic components on a printed board and perform various processes in a case where the electronic component is held by the suction nozzle. The electronic component mounting apparatus has a line sensor unit for detecting presence or absence and a posture of an electronic component, a component recognition camera for recognizing a position of the electronic component held by suction by the suction nozzle, and a CPU for controlling the suction nozzle to discharge the electronic component in an exhaust box and controlling to skip this suction nozzle in a case where the line sensor unit does not detect the electronic component held by the suction nozzle when the line sensor unit performs detection whether or not the electronic component is held by the suction nozzle after a mounting operation of the electronic component held by the suction nozzle on a printed board, but in a case where the component recognition camera detects the electronic component held by the suction nozzle.