One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.

 
Web www.patentalert.com

< Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink

> Retaining device for heat sink

> Thermally conductive interface

~ 00523