An apparatus for enclosing electronic components such as used in telecommunication systems is disclosed. The apparatus includes a housing defining a chamber, with the housing comprising a front wall having an outer surface and a length dimension greater than a width dimension. A pair of opposing side walls are each contiguous with the front wall, and a pair of opposing end walls are each contiguous with the side walls and the front wall. A plurality of non-removable heat transfer fins are an integral part of the outer surface of the front wall. The fins are positioned at an angle with respect to the length dimension of the front wall, with each of the fins having a continuous uninterrupted structure across the outer surface between the opposing side walls. A removable back cover opposite the front wall is configured to seal the chamber of the housing.