A self-emission panel and a method of manufacturing a self-emission panel
which can prevent emission failures from occurring due to various
factors, thereby achieving a self-emission panel that is free from
emission failures. The self-emission panel is manufactured by forming a
first conductive layer on a substrate directly or via other layers,
forming a deposition layer including a luminescent layer on the first
conductive layer, and forming a second conductive layer on the deposition
layer. This manufacturing method includes: a first step of forming a
sectioning layer for sectioning an opening for making a emission area on
the first conductive layer after the formation of the first conductive
layer; a second step of applying surface treatment to at least the
surface of the first conductive layer inside the opening; and a third
step of depositing a deposition layer on the first conductive layer given
surface treatment in the second step.