An object of the invention is to provide a method for manufacturing a semiconductor device having a semiconductor element with a minute structure, which can reduce a cost and improve throughput due to a small number of steps and reduction in a material. One feature of the invention is to form a first film pattern over a substrate, form a second film pattern which is curved on the surface of the first film pattern or the substrate, and form a film pattern by irradiating the first film pattern with light with the second film pattern therebetween and modifying part of the second film pattern.