A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.