A method and apparatus for cleaning contaminated surfaces, especially
semiconductor wafers, using energetic cluster beams is disclosed. In this
system, charged beams consisting of microdroplets or clusters having a
prescribed composition, velocity, energy and size are directed onto a
target substrate dislodging contaminant material. The charged, high
energy cluster beams are formed by electrostatically atomizing a
conductive fluid fed pneumatically to the tip of one or more
capillary-like-emitters.