A semiconductor device including: a semiconductor chip including a
substrate, an outer-connection electrode, and a bump, wherein the bump
has a first conductive layer and a second conductive layer provided on
the first conductive layer, and the second conductive layer is made of
copper; a wiring board having a land; and an insulating material
dispersed with conductive particles, wherein the conductive particles
connect between the bump and the land, wherein an electrical connection
is established by the conductive particles having penetrated to both the
second conductive layer and the land.