Aspects of the invention can provide a method of fabricating an organometallic compound film capable, by stably forming a film with the organometallic compound, of increasing bonding forces of junction interfaces and of realizing a hyper thin film, the organometallic compound film, and an organoelectronic device (e.g., an organic electroluminescence device, an organic solar battery, or an organic thin film transistor) and an electronic device equipped with the organometallic compound film are provided. The method of fabricating a thin film of an organometallic compound on a substrate, can include the step of forming an organic material by a liquid phase process and the step of forming metal by a vapor phase process to form a thin film of an organometallic compound composed of the organic material and the metal.