Apparatus and techniques are provided for modifying and measuring surfaces of diamond workpieces and other workpieces with nanoscale precision. The apparatus and techniques exploit scanning probe microscopy (SPM) and atomic force microscopy (AFM) at a wide range of operating temperatures. In some embodiments, the SPM/AFM apparatus also includes an interferometric microscope and/or acoustic-wave microscope for making high-precision measurements of workpiece surfaces.

 
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