A phase change memory device and a method of fabricating the same are disclosed. The phase change memory device includes a first conductor pattern having a first conductivity type and a sidewall. A second conductor pattern is connected to the sidewall of the first conductor pattern to form a diode. A phase change layer is electrically connected to the second conductor pattern and a top electrode is connected to the phase change layer.

 
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> Dielectric plasma etch process with in-situ amorphous carbon mask with improved critical dimension and etch selectivity

> Method for manufacturing silicon carbide semiconductor device

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