An electrostatic chuck structure for holding an article is presented. The chuck structure comprises an electrically insulating chuck body layer having a first flat surface for holding the article thereon, and a second opposite surface having a honeycombed pattern in the form of an array of spaced-apart grooves. This second patterned surface of the chuck body surface for depositing thereon an electrically conductive layer (electrodes). A dielectric spacer between the electrodes and the article on the chuck body layer is defined by a portion of the chuck body layer between the grooves' bottom and the flat surface.