A press-bonding anisotropic conductive resin composition comprising (A) an organopolysiloxane having on the average at least two alkenyl groups per molecule, (B) an adhesion promoter, (C) finely divided silica, (D) metallized conductive particles, and (E) a curing agent becomes an anisotropic conductor by press bonding. The conductive particles accommodate height variations among electrode terminals, allowing the composition to achieve stable interconnects between all electrode terminals.