A method of manufacturing a semiconductor device includes: forming a
protective film including an opening on a wiring board having an
interconnect pattern so that the protective film has an uneven surface
and a part of the interconnect pattern is exposed in the opening; and
mounting a semiconductor chip including an electrode on the wiring board
so that the part of the interconnect pattern exposed in the opening faces
and is electrically connected with the electrode. The protective film is
formed so that a recess of the uneven surface does not pierce the
protective film.