The electro-conductive substrate of the present invention may comprise
filaments extruded from a die orifice and at least one metal powder
dispensed from a second orifice of the same die unit by way of a gas or
liquid carrier. As the polymeric filament is extruded from the die, one
or more metal powders may be simultaneously dispensed to coat the surface
of the filament. As the polymeric melt and metal powder is extruded, air
pressure is impinged upon the metal powder directing the powder toward
the extruded filament. The metal powder adheres to the molten polymer as
it is extruded for the die, coating the surface of the filament. The
metal powder may also be incorporated into the polymeric melt prior to
extrusion.