A semiconductor structure and its method of fabrication utilize a semiconductor substrate having an active region mesa surrounded by an isolation trench. A first isolation region having a first stress is located in the isolation trench. A second isolation region having a second stress different than the first stress is also located in the isolation trench. The first isolation region and the second isolation region are sized and positioned to rotationally shear stress the active region mesa.

 
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> Method of forming an ultra-thin [[HfSiO]] metal silicate film for high performance CMOS applications and semiconductor structure formed in said method

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