Disclosed herein is a method for forming a highly conductive metal pattern
which comprises forming a metal pattern on a substrate by the use of a
photocatalyst and a selective electroless or electroplating process, and
transferring the metal pattern to a flexible plastic substrate. According
to the method, a highly conductive metal pattern can be effectively
formed on a flexible plastic substrate within a short time, compared to
conventional formation methods. Further disclosed is an EMI filter
comprising a metal pattern formed by the method. The EMI filter not only
exhibits high performances, but also is advantageous in terms of low
manufacturing costs and simple manufacturing process. Accordingly, the
EMI filter can be applied to a variety of flat panel display devices,
including PDPs and organic ELs.