Various methods for analyzing mutual inductance in an integrated circuit
layout are disclosed. In one exemplary embodiment, for instance, a
circuit description indicative of the layout of signal wires and ground
wires in the circuit is received. The signal wires and the ground wires
are grouped into at least a first bundle and a second bundle, wherein the
first bundle and the second bundle each comprise a respective signal-wire
segment and one or more corresponding ground-wire segments. A
representative dipole moment is calculated for the first bundle. Using
the representative dipole moment, the mutual inductance between the first
bundle and the second bundle is calculated. Computer-readable media
storing computer-executable instructions for causing a computer to
perform any of the disclosed methods or storing design databases created
or modified using any of the disclosed techniques are also disclosed.