The invention relates to an optical microelectromechanical structure (MEMS) comprising--an (at least one) optically transmissive layer (UTL)--an (at least one) intermediate layer structure (IL)--a (at least one) device layer (DL) said intermediate layer structure (IL) defining one or more optical paths (OP) between said substantially optically transmissive layer (UTL) and said device layer (DL), said intermediate structure layer (IL) defining the distance (d) between said optically transmissive layer (UTL) and said device layer (DL).

 
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< Optical interconnect system for high speed microprocessor input/output (IO)

> Printed circuit board and manufacturing method thereof

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