An exemplary ball grid array package for a semiconductor device includes an integrated circuit on a substrate, and a first bus on the substrate, the first bus including first portions that extend substantially parallel to the integrated circuit, interleaved with second portions that extend substantially toward the integrated circuit, each second portion having an end contiguous with a first portion and another end contiguous with a another first portion. A first set of wires connects the first bus with a first plurality of nodes on the integrated circuit. The package also includes a second bus and a second set of wires.