Methods and structures for die packages are described. The die package
includes an integrated circuit die connected to and elevated above a
substrate. In an embodiment, wire bonds connects pads on the die to pads
on the substrate. The substrate pads are closely adjacent the die due to
the die support being positioned inwardly of the peripheral surface of
the die. In an embodiment, the die support includes a paste that flows
outwardly when connecting the die to the substrate. The outward paste
flow extends from beneath the die support but does not extend outwardly
of the die so as to not interfere or contact the substrate pads.