Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

 
Web www.patentalert.com

< Enhanced anti-parallel-pinned sensor using thin ruthenium spacer and high magnetic field annealing

> Disc drive suspension including a load beam that has an insular region at which a laser weld is formed provided in an interior of a partially etched portion

~ 00495