In systems and methods measure overlay error in semiconductor device manufacturing based on target image asymmetry. As a result, the advantages of using very small in-chip targets can be achieved, while their disadvantages are reduced or eliminated. Methods for determining overlay error based on measured asymmetry can be used with existing measurement tools and systems. These methods allow for improved manufacturing of semiconductor devices and similar devices formed from layers.

 
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< Sample masking in ellipsometer and the like systems including detection of substrate backside reflections

> Self-calibrating optical reflectance probe system

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