A metal resistor and resistor material are disclosed. The metal resistor may include an infused metal selected from the group consisting of: copper (Cu) infused with at least one of silicon (Si), nitrogen (N.sub.2), carbon (C), tantalum (Ta), titanium (Ti) and tungsten (W), and aluminum infused with at least one of silicon (Si), nitrogen (N.sub.2), carbon (C), tantalum (Ta), titanium (Ti) and tungsten (W). The resistor material may include one of: copper (Cu) infused with at least one of silicon (Si), nitrogen (.sub.2), carbon (C), tantalum (Ta), titanium (Ti) and tungsten (W), and aluminum infused with at least one of silicon (Si), nitrogen (N.sub.2), carbon (C), tantalum (Ta), titanium (Ti) and tungsten (W).