An optical device and method for making the same is disclosed. The device
includes having a circuit element that is located in an opaque enclosure.
The circuit element includes a die having an optical integrated circuit
mounted on a carrier. The carrier includes a plurality of conductors
connected to the optical integrated circuit. The opaque enclosure has a
transparent window therein. The carrier is positioned in the enclosure
such that light entering the enclosure through the window illuminates the
die. The enclosure further includes an aperture through which the
conductors protrude from the enclosure. The enclosure is at least
partially filled with a layer of optically transparent material that
passes light utilized or generated by said optical integrated circuit.
The enclosure can be preformed to a higher degree of precision than that
obtainable on conventional packaging fabrication lines.