An electronic component includes a substrate, a capacitor, and a wiring.
The capacitor has a multilayer structure including a first electrode film
provided on the substrate, a second electrode film of 2 to 4 .mu.m in
thickness disposed to face the first electrode film, and a dielectric
film interposed between the first and the second electrode film. The
wiring includes a joint portion connected to the second electrode film,
on the opposite side of the dielectric film.