A high reliability semiconductor device is provided which can prevent
electromigration due to the deposition of metal ions originating from
wires. The device includes: a flexible wiring board 11 including a base
film 1 and multiple wires 9; a semiconductor chip 5 mounted to the
flexible wiring board 11; and a sealing resin 6 disposed between the
flexible wiring board 11 and the semiconductor chip 5 so as to at least
partially in contact with the wires 9. The sealing resin 6 contains a
metal ion binder mixed thereto.