A method for fabricating a thin film component according to one embodiment comprises forming a wafer having a thin film layer, a release layer, and a patterned layer of photoresist; transferring the pattern of the layer of photoresist to the release layer and the thin film layer; adding a layer of metal to the wafer; heating the wafer to a predetermined temperature for a period of time sufficient to cause deformation of the photoresist to an extent that the photoresist creates cracks in the metal layer; applying a solvent to dissolve at least a portion of the release layer, the solvent penetrating the cracks in the metal layer to reach the release layer; and removing the release layer and any portions of the layers above the release layer.