A system to process requests for wafer structure profile determination
from optical metrology measurements off a plurality of structures formed
on one or more wafer includes a diffraction signal processor, a
diffraction signal distributor, and a plurality of profile search
servers. The diffraction signal processor is configured to obtain a
plurality of measured diffraction signals of the plurality of structures.
The diffraction signal distributor is coupled to the diffraction signal
processor. The diffraction signal processor is configured to transmit the
plurality of measured diffraction signals to the diffraction signal
distributor. The plurality of profile search servers is coupled to the
diffraction signal distributor. The diffraction signal distributor is
configured to distribute the plurality of measured diffraction signals to
the plurality of profile search servers. The profile search servers are
configured to process in parallel the plurality of measured diffraction
signals to determine profiles of the plurality of structures
corresponding to the plurality of measured diffraction signals.