A heat-dissipating structure having multiple heat pipes for a LED lamp is capable of performing the heat dissipation of the LED lamp. The heat-dissipating structure includes a seat to be heated and a plurality of heat pipes. The bottom surface of the seat to be heated has a surface to be heated for adhering to the LED lamp. The top surface of the seat to be heated has a heat-dissipating surface opposing to the surface to be heated. Each heat pipe has an end to be heated and a condensed end away from the end to be heated. On the heat-dissipating surface of the seat to be heated, a plurality of through holes is provided. The number of the through holes is consistent with that of the heat pipes. The axial direction of the end to be heated of the heat pipe is identical to that of the corresponding through hole, and is substantially perpendicular to the heat-dissipating surface of the seat to be heated.