The present invention relates to electrode assemblies, neurostimulation systems and methods for implanting and using same. In exemplary embodiments, the electrode includes a body having a conductive contact surface dimensioned and configured to contact a patient's skull; and an electrode head associated with the body. The electrode head is sized for subcutaneous positioning adjacent the subject's skull, and the electrode body is of a length and configured such that the electrode body extends at least partially through the patient's skull but does not contact the patient's dura mater. As these electrodes need not directly contact the brain nor penetrate the dura mater to be effective in neurostimulatory applications, they avoid many of the disadvantages, e.g. increased risk of infection and invasive implantation procedures, associated with conventional electrode design.