A method of producing a leadframe is provided, the method including the
steps of providing a substrate, plating the substrate with a layer of
tin, plating a layer of nickel over the layer of tin, and thereafter
plating one or more protective layers over the layer of nickel. The
leadframe may thereafter be heated to produce one or more intermetallic
layers comprising tin, which impedes the out-diffusion of copper from a
base material of the leadframe to the surface thereof.