The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a layer of passivation or on the surface of a thick layer of polymer. In addition, the process of the invention provides a method for mounting discrete electrical components at a significant distance removed from the underlying silicon surface.

 
Web www.patentalert.com

< Minimizing resist poisoning in the manufacture of semiconductor devices

> Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices

~ 00480