An LED package and method for producing the same are described. The LED
package has an LED die with a conductive region-forming surface and a
plurality of conductive regions disposed on the conductive region-forming
surface. An insulation layer is formed on the conductive region-forming
surface of the LED die, and has a plurality of openings corresponding to
the conductive regions, respectively. A conductive member fills a
respective opening, and is electrically connected a respective conductive
regions to an exterior circuit.