A surface mount electronic component includes a set of a first lead terminal 2a and a second lead terminal 3b, a semiconductor element 6a die-bonded to an island portion 4a integrally formed at an end of the first lead terminal, a metal wire 7a electrically connecting the semiconductor element and a bonding portion 5b integrally formed at an end of the second lead terminal to each other, and a package 8 made of synthetic resin and hermetically sealing the island portion and the bonding portion. The island portion and the bonding portion are formed by plastic deformation of a portion of each of the lead terminals to be positioned within the package from a lower surface side to reduce the thickness and increase the width. A portion of a lower surface of each of the first lead terminal and the second lead terminal which is not subjected to the plastic deformation is exposed at a lower surface of the package to serve as a mount surface for soldering, so that a soldering area large enough to perform soldering is provided at each of the lead terminals.