The present invention is directed to materials treatable by electron beam (EB) processing, such as materials for flexible packaging. The material comprises a substrate; an ink formulation on at least a portion of the substrate, the ink formulation comprising ink and at least one monomer selected from acrylate esters, vinyl ethers, cycloaliphatic diepoxides, and polyols; and a lacquer on at least a portion of the ink formulation, the lacquer comprising at least one monomer selected from acrylate esters, vinyl ethers, cycloaliphatic diepoxides, and polyols. The processing apparatus for EB treating the material operates at a low voltage, such as 125 kVolts or less.