A detector assembly is presented. The detector assembly includes a first detector layer having a top side and a bottom side, where the first detector layer includes a plurality of first coupling gaps. Additionally, the detector assembly includes a first interconnect structure operationally coupled to the first detector layer and configured to facilitate transfer of a first set of image data from the first detector layer to backplane electronics. The detector assembly also includes a second detector layer having a top side and a bottom side and disposed adjacent the bottom side of the first detector layer, where the second detector layer includes a plurality of second coupling gaps configured to facilitate passage of the first interconnect structure from the first detector layer to the backplane electronics. Also, the detector assembly includes a second interconnect structure operationally coupled to the second detector layer and configured to facilitate transfer of a second set of image data from the second detector layer to the backplane electronics.